Chemical vapor deposition (CVD) is a process used to grow a film of solid material by transporting a chemical precursor in its vapor phase and decomposing it through heat. Typically, a material in its solid form is vaporized and diluted … Continue reading → […]

It has been proven that the design lenses which images near the diffraction are limited only over narrow bandwidths in wavelength. This is a consequence of the phenomenon of dispersion where index of refraction changes with the wavelength of the … Continue reading → […]

Lithography comes from the Greek words lithos, which means ‘stone’, and graphein, which means ‘to write’.  It is the process used to print by transferring a mirror image of the pattern from the flat surface. It was developed in 1976 … Continue reading → […]

With a thickness of only one atom and weighing around 0.77 milligrams per square meter, Graphene is one of the strongest materials known to man, with a breaking strength of 100 to 300 times greater than steel, and one of … Continue reading → […]

In the last few decades, several times companies and research organizations have proposed potentially disrupting innovations in the semiconductor arena, but almost all the times the Intel steamroller crushed them. Transputers, innovative RISC architectures, clock-less chips and other technologies that … Continue reading → […]

Photolithography is one of the main parts of the microprocessor manufacturing steps. There are currently three types of photolithography processes: contact alignment photolithography, proximity alignment photolithography, projection or stepper lithography. Contact alignment lithography is the simplest and involves a light … Continue reading → […]

Molecular beam epitaxy (MBE), a technique used to form an epitaxial growth, is very often used in semiconductor industry as deposition method of thin films on wafer substrates due to its efficiency, controlled doping characteristic, repeatability, and uniformity. But before … Continue reading → […]

Any wafer fabrication involves deposition of layers of materials, which will serve as a conductor, an insulator, or a buffer. Thin film metal layers like aluminum interconnects are deposited in the wafer substrate through Physical Vapor Deposition (PVD) – a … Continue reading → […]

Sputtering deposition is one of the main physical vapor deposition techniques to deposit thin films of metals or other materials over a substrate. The technique is useful for microelectronics applications and has been widely popular in the industry for several … Continue reading → […]

A report from IHS Technology released a couple of months ago revealed that Samsung and Apple were the top buyers of semiconductor chips in 2013 among the leading original equipment manufacturers (OEMs). Myson Robles-Bruce, senior analyst for semiconductor spend and … Continue reading → […]