Martini Tech


PVD: Sputtering and Thermal Evaporation

One of the earliest PVD techniques is the thermal evaporation. In thermal evaporation, the metal is heated to its vaporization point. It will then evaporate to the wafer to form the thin film.  However, since evaporated materials tend to be directional, thermal evaporation provides poor coverage. … Continue reading […]

Molecular beam epitaxy

Molecular beam epitaxy (MBE), a technique used to form an epitaxial growth, is very often used in semiconductor industry as deposition method of thin films on wafer substrates due to its efficiency, controlled doping characteristic, repeatability, and uniformity. But before immersing to MBE, let’s take a quick look on its mother form the epitaxial deposition. … Continue reading […]

Molecular beam epitaxy (MBE)

PVD (physical vapor deposition) through sputtering

Sputtering is one of the methods by which physical vapor deposition (PVD) is achieved. PVD is a process where a thin film of material is deposited on the surface of a substrate. In sputter deposition, high-energy particles are utilized to remove or eject atoms or molecules from the surface of a target material. The ejected atoms are removed from the target material and deposit on a substrate as a thin film. Sputtering is one of the most common methods used to deposit various thin metallic films on wafer substrates, with gold, platinum, aluminum, and tungsten among the common target materials. … Continue reading […]